CMP 过滤

Chemical Mechanical Planarization(CMP) is a polishing process used to manufacture wafers for the semiconductor industry. it requires the use of a polishing tool and polishing slurry and treat wafers to be flat . Slurry filtration is a key process. The slurry particles range is 30-200um regularly, but some particle control is 0.5um. if unfiltered, scratch the wafer during polishing.




CMP 过滤流程图


如需更多资料,请联系科百特销售部:0571-87704266 /